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Substrata offers a full suite of platinum coated silicon and glass substrates
All coatings are deposited under vacuum using electron beam evaporation. Applications include corrosion-resistant electrodes, MEMS, sensors, and electrochemistry.
Substrates are pre-cleaned via low-energy argon ion beam exposure directly before metallization. Films are deposited at high vacuum pressures ≤ 2E-6 Torr and at mild deposition rates to ensure the highest degree of purity and quality.
We use a thin titanium adhesion layer (2-7 nm) between the substrate and platinum coating. This adhesion layer is optional. Custom sizes and materials can also be fabricated to meet your needs.
Application Fields
Technical Features
High quality substrates coated with 1000 Å (100 nm) of platinum. All coatings include a 50 Å titanium adhesion layer between the substrate surface and the platinum coating.
Product #
Description
Coating
Thickness
Adhesion
Unit
QA05-00391
Platinum Coated Ø4 in Silicon Wafer1000 Å Pt | Ø101.6 mm x 0.525 mm thick
Platinum (99.99 %)
1000 Å
50 Å Ti
1/pkg
SIPT-01000-Q20
Platinum Coated Silicon Chips | 20/pk1000 Å Pt | 10 mm x 10 mm x 0.525 mm
Platinum (99.99 %)
1000 Å
50 Å Ti
20/pkg
Product #
Description
Coating
Thickness
Adhesion
Unit
SSPT-01000-Q5
Platinum Coated Microscope Slides1000 Å Pt | 25 mm x 75 mm x 1 mm
Platinum (99.99 %)
1000 Å
50 Å Ti
5/pkg
SCPT-01000-Q20
Platinum Coated Glass Coverslips1000 Å Pt | 22 mm x 22 mm x 0.2 mm
Platinum (99.99 %)
1000Å
50 Å Ti
20/pkg