TITANIUM NITRIDE (TiN) COATED PRODUCTS

Substrata offers a full suite of titanium nitride coated silicon and glass

Angstrom Engineering has developed an effective low-temperature method for depositing ultra-pure, highly dense, and conductive TiN (< 100 µΩ·cm) thin films onto glass and silicon substrates. This is achieved using a new reactive Bipolar High Power Impulse Magnetron Sputtering (Bi-HiPIMS) technology. HiPIMS uses pulsed power at very high peak power density that yields a high ionization of sputtered species. A positive reverse voltage is applied immediately after the normal negative HiPIMS pulse (“Bipolar” HiPIMS) which accelerates these ions towards the substrate surface while simultaneously exposing them to reactive N2 gas. This ion bombardment on the surface of the growing film is essential for creating a high-quality and dense TiN coating without needing to rely on extreme temperatures often required for more traditional sputtering methods.

Titanium nitride (TiN) thin films have an excellent thermal and bio stability, strength, and resistance to corrosion under extreme conditions. TiN is often applied as an effective hard coating on steel, carbide, and aluminum components. It is also used to protect sliding surfaces, as a tribological layer for cutting tools, and is an excellent non-toxic coating found in biomedical devices. Thin film TiN is also used in microelectronics, serving as both a metal and silicon diffusion layer and an excellent conductive connection between active devices and metal contacts. There is also significant research effort into the understanding of TiN superconducting properties that vary with sample preparation and temperature. Custom sizes and materials can also be fabricated to meet your needs.